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ds-ixd_602 - r02 www.clare.com 1 rohs 2002/95/ec e 3 pb features ? 2a peak source/sink drive current ? wide operating voltage range: 4.5v to 35v ? -40c to +125c extended operating temperature range ? logic input withstands negative swing of up to 5v ? matched rise and fall times ? low propagation delay time ? low 10 a supply current ? low output impedance applications ? efficient power mosfet and igbt switching ? switch mode power supplies ? motor controls ? dc to dc converters ? class-d switching amplifiers ? pulse transformer driver description the ixdf602/ixdi602/ixdn602 dual high-speed gate drivers are especially well suited for driving the latest ixys mosfets and igbts. each of the two outputs can source and sink 2a of peak current while producing voltage rise and fall times of less than 10ns. the input of each driver is cmos compatible, and is virtually immune to latch up. proprietary circuitry eliminates cross conduction and current ?shoot-through.? low propagation delay and fast, matched rise and fall times make the ixd_602 family ideal for high-frequency and high-power applications. the ixdn602 is configured as a dual non-inverting driver, the ixdi602 is configured as a dual inverting driver, and the ixdf602 has one inverting and one non-inverting driver. the ixd_602 family is available in a standard 8-pin dip (pi), an 8-pin soic (sia), an 8-pin power soic with an exposed metal back (si), and an 8-pin dfn (d2) package. ordering information part number logic configuration package type packing method quantity ixdf602d2tr 8-pin dfn tape & reel 2000 ixdf602pi 8-pin dip tube 50 ixdf602si 8-pin power soic with exposed metal back tube 100 ixdf602sitr 8-pin power soic with exposed metal back tape & reel 2000 ixdf602sia 8-pin soic tube 100 IXDF602SIATR 8-pin soic tape & reel 2000 ixdi602d2tr 8-pin dfn tape & reel 2000 ixdi602pi 8-pin dip tube 50 ixdi602si 8-pin power soic with exposed metal back tube 100 ixdi602sitr 8-pin power soic with exposed metal back tape & reel 2000 ixdi602sia 8-pin soic tube 100 ixdi602siatr 8-pin soic tape & reel 2000 ixdn602d2tr 8-pin dfn tape & reel 2000 ixdn602pi 8-pin dip tube 50 ixdn602si 8-pin power soic with exposed metal back tube 100 ixdn602sitr 8-pin power soic with exposed metal back tape & reel 2000 ixdn602sia 8-pin soic tube 100 ixdn602siatr 8-pin soic tape & reel 2000 i n a i n b a b outa outb i n a i n b a b outa outb i n a i n b outa outb a b ixd_602 2-ampere dual low-side ultrafast mosfet drivers
ixd_602 r02 www.clare.com 2 1. specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 pin configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.4 recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.5 electrical characteristics: t a = 25c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.6 electrical characteristics: t a = - 40c to +125c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.7 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2. ixd_602 performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 characteristics test diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3. block diagrams & truth tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.1 ixdi602 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.2 ixdf602. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.3 ixdn602 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4. typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5. manufacturing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.1 moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.2 esd sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.3 reflow profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.4 mechanical dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
ixd_602 r02 www.clare.com 3 1 specifications 1.1 pin configurations 1.2 pin definitions 1.3 absolute maximum ratings unless otherwise specified, absolute ma ximum electrical ratings are at 25c absolute maximum ratings are stress rating s. stresses in excess of these ratings c an cause permanent damage to the device. functional operation of the device at condit ions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 recommended operating conditions ixdf602 n c i n a g n d i n b n c outa v cc outb 1 4 3 2 8 5 6 7 a b ixdi602 n c i n a g n d i n b n c outa v cc outb 1 4 3 2 8 5 6 7 a b ixdn602 n c i n a g n d i n b n c outa v cc outb 1 4 3 2 8 5 6 7 a b pin name description ina channel a logic input inb channel b logic input outa outa channel a output - sources or sinks current to turn-on or turn-off a discrete mosfet or igbt outb outb channel b output - sources or sinks current to turn on or turn off a discrete mosfet or igbt v cc supply voltage - provides power to the device gnd ground - common ground reference for the device parameter symbol minimum maximum units supply voltage v cc -0.3 40 v input voltage v in -5.0 v cc +0.3 v output current i out -2a junction temperature t j -55 +150 c storage temperature t stg -65 +150 c parameter symbol minimum maximum units supply voltage v cc 4.5 35 v operating temperature range t a -40 +125 c
ixd_602 4 www.clare.com r02 1.5 electrical characteristics: t a = 25c test conditions: 4.5v < v cc < 35v, one channel (unless otherwise noted). 1.6 electrical characteristics: t a = - 40c to +125c test conditions: 4.5v < v cc < 35v, one channel (unless otherwise noted). parameter conditions symbol minimum typical maximum units input voltage, high 4.5v < v cc < 18v v ih 3.0 - - v input voltage, low 4.5v < v cc < 18v v il --0.8 input current 0v < v in < v cc i in --10 a output voltage, high - v oh v cc -0.025 -- v output voltage, low - v ol - - 0.025 output resistance, high state v cc =18v, i out =-10ma r oh -2.54 output resistance, low state v cc =18v, i out =10ma r ol -1.53 output current, continuous limited by package power dissipation i dc --1a rise time v cc =18v, c load =1000pf t r -7.515 ns fall time v cc =18v, c load =1000pf t f -6.515 on-time propagation delay v cc =18v, c load =1000pf t ondly -3560 off-time propagation delay v cc =18v, c load =1000pf t offdly -3860 power supply current v cc =18v, v in =3.5v i cc -13ma v cc =18v, v in =0v -<110 a v cc =18v, v in =v cc -<110 parameter conditions symbol minimum maximum units input voltage, high 4.5v < v cc < 18v v ih 3.3 - v input voltage, low 4.5v < v cc < 18v v il -0.65 input current 0v < v in < v cc i in -10 10 a output voltage, high - v oh v cc -0.025 - v output voltage, low - v ol - 0.025 output resistance, high state v cc =18v, i out =-10ma r oh -6 output resistance, low state v cc =18v, i out =10ma r ol -5 output current, continuous limited by package power dissipation i dc -1a rise time v cc =18v, c load =1000pf t r -18 ns fall time v cc =18v, c load =1000pf t f -18 on-time propagation delay v cc =18v, c load =1000pf t ondly -75 off-time propagation delay v cc =18v, c load =1000pf t offdly -75 power supply current v cc =18v, v in =3.5v i cc -3.5ma v cc =18v, v in =0v -150 a v cc =18v, v in =v cc -150
ixd_602 r02 www.clare.com 5 1.7 thermal characteristics 2 ixd_602 performance 2.1 timing diagrams 2.2 characteristics test diagram package parameter symbol rating units ixdd602d2 (8-pin dfn) thermal resistance, junction-to-ambient ja 35 c/w ixd_602pi (8-pin dip) 125 ixd_602si (8-pin power soic) 85 ixd_602sia (8-pin soic) 120 ixd_602si (8-pin power soic) thermal resistance, junction-to-case jc 10 c/w 10% 90% t ondly t offdly t r t f v ih v il i n x outx 10% 90% t ondly t offdly t f t r v ih v il i n x outx inverting driver waveforms non-inverting driver waveforms i n a outa g n d v cc i n b v cc + - v i n 0.1 f10 f outb c load tektronix c u rrent pro b e 6302 tektronix c u rrent pro b e 6302 c load
ixd_602 6 www.clare.com r02 3 block diagrams & truth tables 3.1 ixdi602 3.2 ixdf602 3.3 ixdn602 in x out x 0 1 1 0 ina outa 0 1 1 0 inb outb 0 0 1 1 i n a g n d i n b outa v cc outb v cc i n a g n d i n b outa v cc outb v cc in x out x 0 0 1 1 i n a g n d i n b outa v cc outb v cc
ixd_602 r02 www.clare.com 7 4 typical perform ance characteristics supply volta g e (v) 0 5 10 15 20 25 30 35 40 rise time (ns) 0 20 40 60 8 0 100 120 rise time vs. supply volta g e (v in =0-5v, f=10khz, t a =25oc) c l =4.7nf c l =1nf c l =470pf supply volta g e (v) 0 5 10 15 20 25 30 35 40 fall time (ns) 0 20 40 60 8 0 100 120 fall time vs. supply volta g e (v in =0-5v, f=10khz, t a =25oc) c l =4.7nf c l =1nf c l =470pf temperature (oc) -40-200 204060 8 0 100 120 140 time (ns) 4 5 6 7 8 9 10 11 12 rise & fall time vs. temperature (v in =0-5v, v cc =18v, c l =1nf) t r t f load capacitance (pf) 0 1000 2000 3000 4000 5000 rise time (ns) 0 20 40 60 8 0 100 120 rise time vs. load capacitance v cc =4.5 v v cc = 8v v cc =12 v v cc =1 8v v cc =25 v v cc =30 v v cc =35 v load capacitance (pf) 0 1000 2000 3000 4000 5000 fall time (ns) 0 20 40 60 8 0 100 120 fall time vs. load capacitance v cc =4.5 v v cc = 8v v cc =12 v v cc =1 8v v cc =25 v v cc =30 v v cc =35 v supply volta g e (v) 0 5 10 15 20 25 30 35 40 propa g ation delay (ns) 0 50 100 150 200 propa g ation delay vs. supply volta g e (v in =0-5v, c l =1nf, f=1khz) t offdly t ondly input volta g e (v) 0 5 10 15 20 propa g ation delay (ns) 20 30 40 50 60 70 propa g ation delay vs. input volta g e (v cc =18v, c l =1nf) t offdly t ondly temperature (oc) -40-200 204060 8 0 100 120 140 propa g ation delay (ns) 20 25 30 35 40 45 50 55 propa g ation delay vs. temperature (v cc =18v, c l =1nf) t offdly t ondly temperature (oc) -40-200 204060 8 0 100 120 140 input threshold (v) 1. 8 2.0 2.2 2.4 2.6 2. 8 input threshold vs. temperature (v cc =18v, c l =1nf) min v ih max v il supply volta g e (v) 0 5 10 15 20 25 30 35 40 input threshold (v) 1.0 1.5 2.0 2.5 3.0 3.5 input threshold vs. supply volta g e min v ih max v il
ixd_602 8 www.clare.com r02 load capacitance (pf) 100 1000 10000 supply current (ma) 0 50 100 150 200 supply current vs. load capacitance both outputs active (v cc =8v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz load capacitance (pf) 100 1000 10000 supply current (ma) 0 50 100 150 200 250 300 supply current vs. load capacitance both outputs active (v cc =12v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz frequency (khz) 0.1 1 10 100 1000 10000 supply current (ma) 0.01 0.1 1 10 100 1000 supply current vs. frequency both outputs active (v cc =8v) c l =4.7nf c l =1nf c l =470pf frequency (khz) 0.1 1 10 100 1000 10000 supply current (ma) 0.01 0.1 1 10 100 1000 supply current vs. frequency both outputs active (v cc =12v) c l =4.7nf c l =1nf c l =470pf frequency (khz) 0.1 1 10 100 1000 10000 supply current (ma) 0.01 0.1 1 10 100 1000 supply current vs. frequency both outputs active (v cc =18v) c l =4.7nf c l =1nf c l =470pf load capacitance (pf) 100 1000 10000 supply current (ma) 0 50 100 150 200 supply current vs. load capacitance both outputs active (v cc =18v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz load capacitance (pf) 100 1000 10000 supply current (ma) 0 50 100 150 200 250 300 350 400 supply current vs. load capacitance both outputs active (v cc =35v) f=2mhz f=1mhz f=500khz f=100khz f=50khz f=10khz f=1khz temperature (oc) -40-200 204060 8 0 100 120 140 supply current (ma) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 quiescent supply current vs. temperature (v cc =18v) v i n =3.5 v v i n =5 v v i n =10 v v i n =0 v & 1 8v temperature (oc) -40-200 204060 8 0 100 120 140 supply current (ma) 0.6 0.7 0. 8 0.9 1.0 1.1 1.2 dynamic supply current vs. temperature (v in =0-5v, v cc =18v, c l =1nf, f=1khz) frequency (khz) 0.1 1 10 100 1000 10000 supply current (ma) 0.01 0.1 1 10 100 1000 supply current vs. frequency both outputs active (v cc =35v) c l =4.7nf c l =1nf c l =470pf supply volta g e (v) 0 5 10 15 20 25 30 35 40 source current (a) 0 -1 -2 -3 -4 -5 -6 -7 - 8 output source current vs. supply volta g e (c l =27nf) supply volta g e (v) 0 5 10 15 20 25 30 35 40 sink current (a) 0 1 2 3 4 5 6 7 8 output sink current vs. supply volta g e (c l =27nf)
ixd_602 r02 www.clare.com 9 temperature (oc) -40-200 204060 8 0 100 120 140 source current (a) -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5 -5.0 output source current vs. temperature (v cc =18v, c l =27nf) temperature (oc) -40-200 204060 8 0 100 120 140 sink current (a) 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 output sink current vs. temperature (v cc =18v, c l =27nf) supply volta g e (v) 0 5 10 15 20 25 30 35 40 output resistance ( ) 0 2 4 6 8 10 hi g h-state output resistance vs. supply volta g e (i out = -10ma) supply volta g e (v) 0 5 10 15 20 25 30 35 40 output resistance ( ) 0 2 4 6 8 10 low state output resistance vs. supply volta g e (i out = +10ma)
ixd_602 10 www.clare.com r02 5 manufacturing information 5.1 moisture sensitivity all plastic encapsulated se miconductor packages are susceptible to moisture ingression. clare classified all of its plastic encapsulated device s for moisture sensitivity according to the latest version of the joint industry standard, ipc/jedec j-std-020 , in force at the time of product evaluation. we test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and informat ion in that standard as well as to any limitations set forth in the information or standards referenced below. failure to adhere to the warnings or limitations as establ ished by the listed specificati ons could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. this product carries a moisture sensitivity level (msl) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard ipc/jedec j-std-033 . 5.2 esd sensitivity this product is esd sensitive , and should be handled according to the industry standard jesd-625 . 5.3 reflow profile this product has a maximum body temperature and time rating as shown below. all other guidelines of j-std-020 must be observed. device moisture sensitivity level (msl) rating ixd_602si / ixd_602sia / ixd_602pi msl 1 ixd_602d2 msl 3 device maximum temperature x time ixd_602si / ixd_602sia / ixd_602d2 260c for 30 seconds ixd_602pi 250c for 30 seconds rohs 2002/95/ec e 3 pb
ixd_602 r02 www.clare.com 11 5.4 mechanical dimensions 5.4.1 sia (8-pin soic) 5.4.2 si (8-pin power soic with exposed metal back) recommended pcb land pattern dimensions mm mi n / mm max (inches mi n / inches max) 1.30 / 1.75 (0.051 / 0.069) 0.10 / 0.25 (0.004 / 0.010) 4. 8 0 / 5.00 (0.190 / 0.197) pi n 1 0.31 / 0.51 (0.012 / 0.020) 5. 8 0 / 6.20 (0.22 8 / 0.244) 3. 8 0 / 4.00 (0.150 / 0.157) 1.27 bsc (0.05 bsc) 0.40 / 1.27 (0.016 / 0.050) 0.10 / 0.25 (0.004 / 0.010) 0.25 / 0.50 x45o (0.010 / 0.020 x45o) 0o / 8 o 1.27 (0.050) 5.40 (0.213) 1.55 (0.061) 0.60 (0.024) n ote: molded package conforms to jedec standard config u ration ms-012 v ariation aa. recommended pcb land pattern dimensions mm mi n / mm max (inches mi n / inches max) n otes: 1. molded package conforms to jedec standard config u ration ms-012 v ariation ba. 2. the exposed metal pad on the b ack of the si package may b e left floating or connected to g n d. it is not s u ita b le for carrying c u rrent. 1.30 / 1.75 (0.051 / 0.069) 0.03 / 0.10 (0.001 / 0.004) 4. 8 0 / 5.00 (0.190 / 0.197) pi n 1 0.31 / 0.51 (0.012 / 0.020) 5. 8 0 / 6.20 (0.22 8 / 0.244) 3. 8 0 / 4.00 (0.150 / 0.157) 1.27 bsc (0.05 bsc) 0.40 / 1.27 (0.016 / 0.050) 0.10 / 0.25 (0.004 / 0.010) 0.25 / 0.50 x45o (0.010 / 0.020 x45o) 0o / 8 o 2.29 / 2.79 (0.090 / 0.110) 3.30 / 3. 8 1 (0.130 / 0.150) 1.27 (0.050) 5.40 (0.209) 1.55 (0.061) 0.60 (0.024) 2.75 (0.10 8 ) 3. 8 0 (0.150)
ixd_602 12 www.clare.com r02 5.4.3 tape & reel information for si and sia packages 5.4.4 pi (8-pin dip) n otes: 1. a 0 & b 0 meas u red at 0.3mm a b o v e b ase of pocket. 2. 10 pitches c u m u lati v e tol. 0.2mm 3. ( ) reference dimensions only. 4. unless other w ise specified, all dimensions in millimeters. k 0 =2.30 0.10 b 0 =5.20 0.10 r0.50 typ 8 .00 0.10 2.00 0.10 4.00 0.10 see n ote #2 12.00 0.30 5.50 0.10 1.75 0.10 ? 1.50 (mi n ) ? 1.55 0.05 1. 8 0 0.10 (3.40) 0.30 0.05 (70o) a 0 =6.40 0.10 (4.70) (1.20) a a b b sectio n a-a sectio n b-b em b ossment em b ossed carrier to p c o v er tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) dimensions mm mi n / mm max (inches mi n / inches max) n ote: molded package conforms to jedec standard config u ration ms-001 v ariation ba. pc board pattern 7.62 / 10.92 (0.300 / 0.430) 7.62 bsc (0.300 bsc) 0.20 / 0.3 8 (0.00 8 / 0.015) 7.37 / 8 .26 (0.290 / 0.325) 0.3 8 / 0.5 8 (0.015 / 0.023) 1.14 / 1.65 (0.045 / 0.065) 0.3 8 / 1.02 (0.015 / 0.040) 3.05 / 3. 8 1 (0.120 / 0.150) 3.43 / 4.70 (0.135 / 0.1 8 5) 3.1 8 / 3. 8 1 (0.125 / 0.150) 8 -0.900 dia. ( 8 -0.035 dia.) 7.50 (0.295) 2.540 (0.100) 9.02 / 10.16 (0.355 / 0.400) 6.10 / 6. 8 6 (0.240 / 0.270) 2.540 bsc (0.100 bsc) 1.40 (0.055)
ixd_602 r02 www.clare.com 13 5.4.5 d2 (8-pin dfn) 5.4.6 tape & reel information for d2 package dimensions mm mi n / mm max (inches mi n / inches max) 5.00 bsc (0.197 bsc) 4.00 bsc (0.15 8 bsc) 0. 8 0 / 1.00 (0.031 / 0.039) 0.00 / 0.05 (0.000 / 0.002) 0.95 bsc (0.037 bsc) 0.76 / 0. 8 1 (0.030 / 0.032) 0.30 / 0.45 (0.012 / 0.01 8 ) 3.04 / 3.09 (0.120 / 0.122) 2.54 / 2.59 (0.100 / 0.102) 0.35 / 0.45 x 45o (0.014 / 0.01 8 x 45o) pin 1 pin 1 pin 8 0.20 ref (0.00 8 ref) recommended pcb land pattern 4.50 (0.177) 0.45 (0.01 8 ) 1.20 (0.047) 3.05 (0.120) 2.55 (0.100) 0.95 (0.037) 0.35 x 45o (0.014 x 45o) n ote: the exposed metal pad on the b ack of the d2 package may b e left floating or connected to gro u nd. it is not s u ita b le for carrying c u rrent. k 0 =1.90 0.10 b 0 =5.40 0.10 5o max a 0 =4.25 0.10 5o max 0.30 0.05 (0.05) (0.05) r0.75 typ 8 .00 0.10 2.00 0.05 4.00 0.10 see n ote #2 12.00 0.30 5.50 0.05 1.75 0.10 ? 1.50 (mi n ) ? 1.55 0.05 n otes: 1. a 0 & b 0 meas u red at 0.3mm a b o v e b ase of pocket. 2. 10 pitches c u m u lati v e tol. 0.2mm 3. ( ) reference dimensions only. 4. unless other w ise specified, all dimensions in millimeters. em b ossment em b ossed carrier to p c o v er tape thickness 0.102 max. (0.004 max.) 330.2 dia. (13.00 dia.) for additional information please vi sit our website at: www.clare.com clare, inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publica tion and reserves the right to make changes to specifications and product descriptions at any time without notice. neither circuit patent licenses nor indemnity are expressed or implied. except as set forth in clare?s standard terms and conditions of sale, clare, inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. the products described in this document are not designed, intended, authorized or warranted for use as components in systems in tended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of clare?s product may result in direct physical harm, i njury, or death to a person or severe property or environmental damage. clare, inc. reserves the right to discontinue or ma ke changes to its products at any time without notice. specification: ds-ixd_602-r02 ?copyright 2011, clare, inc. all rights reserved. printed in usa. 2/3/2011

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